A CT scanner reveals surprises inside the 386 processor's ceramic package

The blog post explores the intricate design and manufacturing of Intel's 386 processor packaging, revealed through a 3-D CT scan. It details the complexity inside the ceramic package, including multiple wiring layers and power networks that enhance performance and address electrical noise. Key observations include the chip’s unique separate power and ground networks for I/O and CPU logic, as well as the innovative packaging process that underpinned its design. Overall, the insights into the 386’s architecture offer a glimpse into the challenges and advancements in early microprocessor technology.